Granted Patent
Utility
US 6,309,224 · App. 09/467,502
High density wirebond connector assembly
Inventors:
Daniel A. Lawlyes, Jay Kelly, Anthony Raschilla
Patented Case
View Patent ↗
Granted: Oct 30, 2001
Filed: Dec 20, 1999
Inventors
Daniel A. Lawlyes
Jay Kelly
Anthony Raschilla
Assignee (at issue)
Delphi Technologies
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.