Granted Patent
Utility
US 6,313,998 · App. 09/285,354
Circuit board assembly having a three dimensional array of integrated circuit packages
Inventors:
Kenneth J. Kledzik, Jason C. Engle
Patented Case
View Patent ↗
Granted: Nov 6, 2001
Filed: Apr 2, 1999
Inventors
Kenneth J. Kledzik
Jason C. Engle
Assignee (at issue)
Legacy Electronics, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.