IP Library Granted Patent US 6,315,641
Granted Patent Utility
US 6,315,641 · App. 09/509,334

Method and apparatus for chemical mechanical polishing

Inventors: Kyu Hong Lee, Yong Byouk Lee, Sang Won Kang
Patented Case View Patent ↗
Granted: Nov 13, 2001 Filed: Mar 24, 2000
Inventors
Kyu Hong Lee
Yong Byouk Lee
Sang Won Kang
Assignees (at issue)
Semicontect Corp
GENITECH, INC.

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Quick Facts
Patent No.
US 6,315,641
App. No.
09/509,334
Filed
2000-03-24
Granted
2001-11-13
Kind
A