Granted Patent
Utility
US 6,341,418 · App. 09/301,890
Method for direct chip attach by solder bumps and an underfill layer
Inventors:
Guy Paul Brouillette, David Danovitch, Peter A. Gruber, Michael Liehr, Carlos J. Sambucetti
Patented Case
View Patent ↗
Granted: Jan 29, 2002
Filed: Apr 29, 1999
Inventors
Guy Paul Brouillette
David Danovitch
Peter A. Gruber
Michael Liehr
Carlos J. Sambucetti
Assignee (at issue)
International Business Machines Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.