Granted Patent
Utility
US 6,349,033 · App. 09/474,721
Method and apparatus for heat dispersion from the bottom side of integrated circuit packages on printed circuit boards
Inventors:
Israel Dubin, Charles Matthew Erwin
Patented Case
View Patent ↗
Granted: Feb 19, 2002
Filed: Dec 29, 1999
Inventors
Israel Dubin
Charles Matthew Erwin
Assignee (at issue)
Radisys Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.