Granted Patent
Utility
US 6,368,955 · App. 09/444,817
Method of polishing semiconductor structures using a two-step chemical mechanical planarization with slurry particles having different particle bulk densities
Inventors:
William Easter, John A. Maze, Frank Miceli
Patented Case
View Patent ↗
Granted: Apr 9, 2002
Filed: Nov 22, 1999
Inventors
William Easter
John A. Maze
Frank Miceli
Assignee (at issue)
LUCENT TECHNOLOGIES INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.