Granted Patent
Utility
US 6,379,782 · App. 09/840,761
Semiconductor device formed with metal wiring on a wafer by chemical mechanical polishing, and method of manufacturing the same
Inventors:
Manabu Iguchi, Yoshihisa Matsubara, Toshiyuki Takewaki
Patented Case
View Patent ↗
Granted: Apr 30, 2002
Filed: Apr 24, 2001
Inventors
Manabu Iguchi
Yoshihisa Matsubara
Toshiyuki Takewaki
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.