Granted Patent
Utility
US 6,380,079 · App. 09/709,624
Metal wiring in semiconductor device and method for fabricating the same
Inventor:
Jung Won Lee
Patented Case
View Patent ↗
Granted: Apr 30, 2002
Filed: Nov 13, 2000
Inventor
Jung Won Lee
Assignee (at issue)
Hyundai Electronics Industries Co. Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.