Granted Patent
Utility
US 6,387,979 · App. 09/571,272
Bonding composition
Inventor:
Kenichi Hino
Patented Case
View Patent ↗
Granted: May 14, 2002
Filed: May 15, 2000
Inventor
Kenichi Hino
Assignee (at issue)
KURARAY CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.