Granted Patent
Utility
US 6,421,108 · App. 09/313,516
Method for fabricating passivation layer
Inventors:
Wei-Shiau Chen, Shuenn-Jeng Chen, Tsan-Wen Liu
Patented Case
View Patent ↗
Granted: Jul 16, 2002
Filed: May 17, 1999
Inventors
Wei-Shiau Chen
Shuenn-Jeng Chen
Tsan-Wen Liu
Assignee (at issue)
WINBOND ELECTRONICS CORP.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.