IP Library Granted Patent US 6,433,300
Granted Patent Utility
US 6,433,300 · App. 09/871,071

Electrode interface bonding

Inventor: Michael C. McBennett
Patented Case View Patent ↗
Granted: Aug 13, 2002 Filed: May 31, 2001
Inventor
Michael C. McBennett
Assignee (at issue)
THE ESAB GROUP INC.

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Quick Facts
Patent No.
US 6,433,300
App. No.
09/871,071
Filed
2001-05-31
Granted
2002-08-13
Kind
B1