Granted Patent
Utility
US 6,433,424 · App. 10/002,252
Semiconductor device package and lead frame with die overhanging lead frame pad
Inventor:
Tim Sammon
Patented Case
View Patent ↗
Granted: Aug 13, 2002
Filed: Oct 26, 2001
Inventor
Tim Sammon
Assignee (at issue)
International Rectifier Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.