Granted Patent
Utility
US 6,440,771 · App. 09/816,516
Method for constructing a wafer interposer by using conductive columns
Inventor:
John Pierce
Patented Case
View Patent ↗
Granted: Aug 27, 2002
Filed: Mar 23, 2001
Inventor
John Pierce
Assignee (at issue)
Eaglestone Partners I, LLC
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.