Granted Patent
Utility
US 6,448,156 · App. 09/715,365
Techniques for maintaining alignment of cut dies during substrate dicing
Inventor:
Alois Tieber
Patented Case
View Patent ↗
Granted: Sep 10, 2002
Filed: Nov 17, 2000
Inventor
Alois Tieber
Assignee (at issue)
Intercon Tools, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.