Granted Patent
Utility
US 6,451,681 · App. 09/411,266
Method of forming copper interconnection utilizing aluminum capping film
Inventor:
Stuart E. Greer
Patented Case
View Patent ↗
Granted: Sep 17, 2002
Filed: Oct 4, 1999
Inventor
Stuart E. Greer
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.