IP Library › Granted Patent US 6,472,334
Granted Patent Utility
US 6,472,334 · App. 09/824,106

Film forming method, semiconductor device manufacturing method, and semiconductor device

Inventors: Hiroshi Ikakura, Tomomi Suzuki, Kazuo Maeda, Yoshimi Shioya, Kouichi Ohira
Patented Case View Patent ↗
Granted: Oct 29, 2002 Filed: Apr 3, 2001
Inventors
Hiroshi Ikakura
Tomomi Suzuki
Kazuo Maeda
Yoshimi Shioya
Kouichi Ohira
Assignees (at issue)
Canon Sales Co., Inc.
Semiconductor Process Laboratory Co., Ltd.

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Quick Facts
Patent No.
US 6,472,334
App. No.
09/824,106
Filed
2001-04-03
Granted
2002-10-29
Kind
B2