Granted Patent
Utility
US 6,476,499 · App. 09/499,579
Semiconductor chip, chip-on-chip structure device and assembling method thereof
Inventors:
Junichi Hikita, Koji Yamamoto, Isamu Nishimura, Nobuhisa Kumamoto
Patented Case
View Patent ↗
Granted: Nov 5, 2002
Filed: Feb 7, 2000
Inventors
Junichi Hikita
Koji Yamamoto
Isamu Nishimura
Nobuhisa Kumamoto
Assignee (at issue)
ROHM CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.