IP Library Granted Patent US 6,478,596
Granted Patent Utility
US 6,478,596 · App. 10/051,825

Semiconductor component mounting apparatus

Inventors: Kenji Yoshida, Takashi Naito, Shigeru Murayama, Katsuhiko Sakamoto, Takashi Masaki
Patented Case View Patent ↗
Granted: Nov 12, 2002 Filed: Jan 16, 2002
Inventors
Kenji Yoshida
Takashi Naito
Shigeru Murayama
Katsuhiko Sakamoto
Takashi Masaki
Assignees (at issue)
Advantest Corporation
AMP (Japan) Ltd. I

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Quick Facts
Patent No.
US 6,478,596
App. No.
10/051,825
Filed
2002-01-16
Granted
2002-11-12
Kind
B2