Granted Patent
Utility
US 6,479,373 · App. 09/884,188
Method of structuring layers with a polysilicon layer and an overlying metal or metal silicide layer using a three step etching process with fluorine, chlorine, bromine containing gases
Inventors:
Joerg Dreybrodt, Dirk Drescher, Ralf Zedlitz, Stephan Wege
Patented Case
View Patent ↗
Granted: Nov 12, 2002
Filed: Jun 19, 2001
Inventors
Joerg Dreybrodt
Dirk Drescher
Ralf Zedlitz
Stephan Wege
Assignee (at issue)
Infineon Technologies AG
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.