Granted Patent
Utility
US 6,483,070 · App. 09/964,072
Electrode component thermal bonding
Inventors:
Gregory W. Diehl, Michael C. McBennett
Patented Case
View Patent ↗
Granted: Nov 19, 2002
Filed: Sep 26, 2001
Inventors
Gregory W. Diehl
Michael C. McBennett
Assignee (at issue)
THE ESAB GROUP INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.