Granted Patent
Utility
US 6,488,781 · App. 09/384,226
Soldering paste, soldering method, and surface-mounted type electronic device
Inventors:
Akira Tanahashi, Norihisa Imaizumi, Seiji Shibata, Eiichi Sudo
Patented Case
View Patent ↗
Granted: Dec 3, 2002
Filed: Aug 27, 1999
Inventors
Akira Tanahashi
Norihisa Imaizumi
Seiji Shibata
Eiichi Sudo
Assignees (at issue)
DENSO CORPORATION
TAMURA KAKEN CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.