IP Library Granted Patent US 6,493,070
Granted Patent Utility
US 6,493,070 · App. 09/642,793

Method for in-situ monitoring layer uniformity of sputter coating based on intensity distribution of plasma spectrum

Inventors: Cheng-Chung Jaing, Chuen-Horng Tsai, Jyh-Shin Chen, Ming-Hwu Cheng, Ho-Yen Hsiao, Py-Shiun Yeh, Jiann-Shiun Kao
Patented Case View Patent ↗
Granted: Dec 10, 2002 Filed: Aug 22, 2000
Inventors
Cheng-Chung Jaing
Chuen-Horng Tsai
Jyh-Shin Chen
Ming-Hwu Cheng
Ho-Yen Hsiao
Py-Shiun Yeh
Jiann-Shiun Kao
Assignee (at issue)
Precision Instrument Development Center of National Science Council

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Quick Facts
Patent No.
US 6,493,070
App. No.
09/642,793
Filed
2000-08-22
Granted
2002-12-10
Kind
B1