IP Library › Granted Patent US 6,509,209
Granted Patent Utility
US 6,509,209 · App. 09/697,706

Method of forming a metal-to-metal antifuse with non-conductive diffusion barrier

Inventors: Mehul D. Shroff, Rajiv Jain
Patented Case View Patent ↗
Granted: Jan 21, 2003 Filed: Oct 25, 2000
Inventors
Mehul D. Shroff
Rajiv Jain
Assignee (at issue)
QuickLogic Corporation

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Quick Facts
Patent No.
US 6,509,209
App. No.
09/697,706
Filed
2000-10-25
Granted
2003-01-21
Kind
B1