Granted Patent
Utility
US 6,510,050 · App. 09/718,866
High density packaging for multi-disk systems
Inventors:
Whay Sing Lee, Nisha Talagala, Chia-Yu Wu, Fay Chong, Jr., Randall D. Rettberg
Patented Case
View Patent ↗
Granted: Jan 21, 2003
Filed: Nov 21, 2000
Inventors
Whay Sing Lee
Nisha Talagala
Chia-Yu Wu
Fay Chong, Jr.
Randall D. Rettberg
Assignee (at issue)
Sun Microsystems Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.