IP Library › Granted Patent US 6,515,363
Granted Patent Utility
US 6,515,363 · App. 09/407,334

In situ plasma pre-deposition wafer treatment in chemical vapor deposition technology for semiconductor integrated circuit applications

Inventor: Weimin Li
Patented Case View Patent ↗
Granted: Feb 4, 2003 Filed: Sep 29, 1999
Inventor
Weimin Li
Assignee (at issue)
Micron Technology, Inc.

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Quick Facts
Patent No.
US 6,515,363
App. No.
09/407,334
Filed
1999-09-29
Granted
2003-02-04
Kind
B2