Granted Patent
Utility
US 6,518,668 · App. 09/730,220
Multiple seed layers for metallic interconnects
Inventor:
Uri Cohen
Patented Case
View Patent ↗
Granted: Feb 11, 2003
Filed: Dec 4, 2000
Inventor
Uri Cohen
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.