Granted Patent
Utility
US 6,524,885 · App. 09/738,228
Method, apparatus and system for building an interposer onto a semiconductor wafer using laser techniques
Inventor:
John Pierce
Patented Case
View Patent ↗
Granted: Feb 25, 2003
Filed: Dec 15, 2000
Inventor
John Pierce
Assignee (at issue)
Eaglestone Partners I, LLC
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.