Granted Patent
Utility
US 6,527,819 · App. 10/022,308
Polishing slurries for copper and associated materials
Inventors:
William A. Wojtczak, Thomas H. Baum, Long Nguyen, Cary Regulski
Patented Case
View Patent ↗
Granted: Mar 4, 2003
Filed: Dec 18, 2001
Inventors
William A. Wojtczak
Thomas H. Baum
Long Nguyen
Cary Regulski
Assignee (at issue)
ADVANCED TECHNOLOGY & MATERIALS CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.