IP Library Granted Patent US 6,528,387
Granted Patent Utility
US 6,528,387 · App. 09/446,306

SOI substrate and process for preparing the same, and semiconductor device and process for preparing the same

Inventors: Yoshitaka Moriyasu, Takashi Morishita, Masahiro Matsui, Makoto Ishida
Patented Case View Patent ↗
Granted: Mar 4, 2003 Filed: Dec 20, 1999
Inventors
Yoshitaka Moriyasu
Takashi Morishita
Masahiro Matsui
Makoto Ishida
Assignee (at issue)
ASAHI KASEI KABUSHIKI KAISHA

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Quick Facts
Patent No.
US 6,528,387
App. No.
09/446,306
Filed
1999-12-20
Granted
2003-03-04
Kind
B1