Granted Patent
Utility
US 6,528,889 · App. 09/342,424
Electronic circuit device having adhesion-reinforcing pattern on a circuit board for flip-chip mounting an IC chip
Inventors:
Tsutomu Matsuhira, Atsushi Endo
Patented Case
View Patent ↗
Granted: Mar 4, 2003
Filed: Jun 29, 1999
Inventors
Tsutomu Matsuhira
Atsushi Endo
Assignee (at issue)
SEIKO INSTRUMENTS INC.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.