IP Library Granted Patent US 6,556,455
Granted Patent Utility
US 6,556,455 · App. 10/022,454

Ultra-low impedance power interconnection system for electronic packages

Inventors: Joseph T. DiBene, II, David Hartke, Carl E. Hoge, Edward Derian
Patented Case View Patent ↗
Granted: Apr 29, 2003 Filed: Oct 30, 2001
Inventors
Joseph T. DiBene, II
David Hartke
Carl E. Hoge
Edward Derian
Assignee (at issue)
Incep Technologies

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Quick Facts
Patent No.
US 6,556,455
App. No.
10/022,454
Filed
2001-10-30
Granted
2003-04-29
Kind
B2