Granted Patent
Utility
US 6,559,499 · App. 09/477,310
Process for fabricating an integrated circuit device having capacitors with a multilevel metallization
Inventors:
Glenn B. Alers, Philip W. Diodato, Ruichen Liu
Patented Case
View Patent ↗
Granted: May 6, 2003
Filed: Jan 4, 2000
Inventors
Glenn B. Alers
Philip W. Diodato
Ruichen Liu
Assignee (at issue)
Agere Systems Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.