Granted Patent
Utility
US 6,566,315 · App. 10/007,490
Formulations including a 1,3-dicarbonyl compound chelating agent and copper corrosion inhibiting agents for stripping residues from semiconductor substrates containing copper structures
Inventors:
William A. Wojtczak, Ma. Fatima Seijo, Dave Bernhard, Long Nguyen
Patented Case
View Patent ↗
Granted: May 20, 2003
Filed: Dec 5, 2001
Inventors
William A. Wojtczak
Ma. Fatima Seijo
Dave Bernhard
Long Nguyen
Assignee (at issue)
ADVANCED TECHNOLOGY & MATERIALS CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.