IP Library Granted Patent US 6,566,980
Granted Patent Utility
US 6,566,980 · App. 09/823,270

Die layout for SAW devices and associated methods

Inventor: Benjamin Paul Abbott
Patented Case View Patent ↗
Granted: May 20, 2003 Filed: Mar 30, 2001
Inventor
Benjamin Paul Abbott
Assignee (at issue)
Sawtek, Inc.

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Quick Facts
Patent No.
US 6,566,980
App. No.
09/823,270
Filed
2001-03-30
Granted
2003-05-20
Kind
B2