Granted Patent
Utility
US 6,573,184 · App. 10/094,571
Apparatus and method for depositing thin film on wafer using atomic layer deposition
Inventor:
Young-Hoon Park
Patented Case
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Granted: Jun 3, 2003
Filed: Mar 7, 2002
Inventor
Young-Hoon Park
Assignee (at issue)
IPS Group Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.