Granted Patent
Utility
US 6,577,004 · App. 09/653,300
Solder ball landpad design to improve laminate performance
Inventors:
Brad D. Rumsey, Patrick W. Tandy, William Reeder, Stephen F. Moxham, Steven G. Thummel, Dana A. Stoddard, Joseph C. Young
Patented Case
View Patent ↗
Granted: Jun 10, 2003
Filed: Aug 31, 2000
Inventors
Brad D. Rumsey
Patrick W. Tandy
William Reeder
Stephen F. Moxham
Steven G. Thummel
Dana A. Stoddard
Joseph C. Young
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.