Granted Patent
Utility
US 6,579,372 · App. 09/848,579
Apparatus and method for depositing thin film on wafer using atomic layer deposition
Inventor:
Young-Hoon Park
Patented Case
View Patent ↗
Granted: Jun 17, 2003
Filed: May 3, 2001
Inventor
Young-Hoon Park
Assignee (at issue)
IPS Group Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.