Granted Patent
Utility
US 6,580,620 · App. 09/548,705
Matrix type printed circuit board for semiconductor packages
Inventor:
Sungjin Kim
Patented Case
View Patent ↗
Granted: Jun 17, 2003
Filed: Apr 13, 2000
Inventor
Sungjin Kim
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.