Granted Patent
Utility
US 6,596,625 · App. 09/932,899
Method and device for producing a metal/metal contact in a multilayer metallization of an integrated circuit
Inventors:
Martin Schneegans, Stephan Wege
Patented Case
View Patent ↗
Granted: Jul 22, 2003
Filed: Aug 20, 2001
Inventors
Martin Schneegans
Stephan Wege
Assignee (at issue)
Infineon Technologies AG
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.