Granted Patent
Utility
US 6,600,215 · App. 09/054,275
Method and apparatus for coupling a semiconductor die to die terminals
Inventors:
Aaron Schoenfeld, Manny K. F. Ma, Larry D. Kinsman, J. Mike Brooks, Timothy J. Allen
Patented Case
View Patent ↗
Granted: Jul 29, 2003
Filed: Apr 2, 1998
Inventors
Aaron Schoenfeld
Manny K. F. Ma
Larry D. Kinsman
J. Mike Brooks
Timothy J. Allen
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.