Granted Patent
Utility
US 6,606,425 · App. 10/100,277
Transfer molded packages with embedded thermal insulation
Inventors:
Douglas E. Crafts, Kenzo Ishida, David J. Chapman, Duane Cook, James F. Farrell, Suresh Ramalingam, Steven M. Swain
Patented Case
View Patent ↗
Granted: Aug 12, 2003
Filed: Mar 18, 2002
Inventors
Douglas E. Crafts
Kenzo Ishida
David J. Chapman
Duane Cook
James F. Farrell
Suresh Ramalingam
Steven M. Swain
Assignee (at issue)
JDS Uniphase Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.