Granted Patent
Utility
US 6,608,390 · App. 10/054,231
Wirebonded semiconductor package structure and method of manufacture
Inventors:
David T. Beatson, Andrew Hmiel
Patented Case
View Patent ↗
Granted: Aug 19, 2003
Filed: Nov 13, 2001
Inventors
David T. Beatson
Andrew Hmiel
Assignee (at issue)
Kulicke & Soffa Investments, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.