Granted Patent
Utility
US 6,610,151 · App. 09/563,733
Seed layers for interconnects and methods and apparatus for their fabrication
Inventor:
Uri Cohen
Patented Case
View Patent ↗
Granted: Aug 26, 2003
Filed: May 3, 2000
Inventor
Uri Cohen
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.