IP Library › Granted Patent US 6,611,098
Granted Patent Utility
US 6,611,098 · App. 09/776,093

Hermetic encapsulation package and method of fabrication thereof

Inventors: Kenji Mori, Yoshikazu Sakaguchi
Patented Case View Patent ↗
Granted: Aug 26, 2003 Filed: Feb 2, 2001
Inventors
Kenji Mori
Yoshikazu Sakaguchi
Assignee (at issue)
NEC CORPORATION

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Quick Facts
Patent No.
US 6,611,098
App. No.
09/776,093
Filed
2001-02-02
Granted
2003-08-26
Kind
B2