Granted Patent
Utility
US 6,614,102 · App. 09/848,864
Shielded semiconductor leadframe package
Inventors:
Paul R. Hoffman, Doug Mathews
Patented Case
View Patent ↗
Granted: Sep 2, 2003
Filed: May 4, 2001
Inventors
Paul R. Hoffman
Doug Mathews
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.