IP Library › Granted Patent US 6,614,247
Granted Patent Utility
US 6,614,247 · App. 10/012,864

Socket apparatus and method for removably mounting an electronic package

Inventors: Kiyokazu Ikeya, Kyozo Katayose
Patented Case View Patent ↗
Granted: Sep 2, 2003 Filed: Oct 22, 2001
Inventors
Kiyokazu Ikeya
Kyozo Katayose
Assignee (at issue)
Texas Instruments Incorporated

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Quick Facts
Patent No.
US 6,614,247
App. No.
10/012,864
Filed
2001-10-22
Granted
2003-09-02
Kind
B2