Granted Patent
Utility
US 6,616,394 · App. 09/223,111
Apparatus for processing wafers
Inventor:
Jae Heon Park
Patented Case
View Patent ↗
Granted: Sep 9, 2003
Filed: Dec 30, 1998
Inventor
Jae Heon Park
Assignee (at issue)
Silicon Valley Group, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.