Granted Patent
Utility
US 6,616,436 · App. 09/687,126
Apparatus for manufacturing semiconductor packages
Inventors:
Hyung Ju Lee, Ku Sun Hong, Jae Hun Ku
Patented Case
View Patent ↗
Granted: Sep 9, 2003
Filed: Oct 13, 2000
Inventors
Hyung Ju Lee
Ku Sun Hong
Jae Hun Ku
Assignee (at issue)
Amkor Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.