Granted Patent
Utility
US 6,618,938 · App. 09/974,157
Interposer for semiconductor package assembly
Inventors:
Maniam Alagaratnam, Kishor Desai, Sunil A. Patel
Patented Case
View Patent ↗
Granted: Sep 16, 2003
Filed: Oct 9, 2001
Inventors
Maniam Alagaratnam
Kishor Desai
Sunil A. Patel
Assignee (at issue)
LSI Logic Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.