Granted Patent
Utility
US 6,621,166 · App. 09/860,304
Five layer adhesive/insulator/metal/insulator/adhesive tape for semiconductor die packaging
Inventor:
Lawrence Kulinsky
Patented Case
View Patent ↗
Granted: Sep 16, 2003
Filed: May 18, 2001
Inventor
Lawrence Kulinsky
Assignee (at issue)
International Rectifier Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.